Method and apparatus for testing an integrated circuit

摘要

An apparatus for testing an integrated circuit (12) includes a bond substrate (14) having a location (26) for an integrated circuit (12). The location (26) on the bond substrate (14) has a plurality of traces (28) around each location (26). A first fixture (10) holds the bond substrate (14) in a fixed relation to first fixture (10) and holds the integrated circuit (12) in a fixed relation to the first fixture (10) and the bond substrate (14). A wirebonder forms wirebonds (32) between the traces (28) and the bond pads (30). An electrical tester provides electrical signals from the traces (28) to the bond pads (30) to verifying the operation of the integrated circuit (12). A second fixture (40) lifts the bond substrate (14) while the integrated circuit (12) remains held to the first fixture (10). A vibrator (46) vibrates the first fixture (10) in relation to the second fixture (40) so that the wirebonds (32) are broken at a predetermined location (50) near the bond pad (30). <IMAGE>