Verfahren und Vorrichtung zum Herstellen von Sacklochbohrungen in Leiterplatten

摘要

A circuit board is mfd. from plastics material (4) reinforced with glass fibres (3). The surface of the board carries copper plating and copper tracks (2) are inset into the main body. Through hole contacts are established by forming a hole that penetrates the board down to the surface of the inset track. The hole is initially drilled to a point just short of the track. Final depth machining is carried out by a laser removing the remaining plastics material. ADVANTAGE - Efficient machining.