Hermetische Verpackung für frequenzselektive Mikroelektronikteile.

摘要

A package (200) for a frequency selection component (70) includes a base (10), a thermoplastic die attachment (60), and either a solder (260) or low-melting-temperature glass (110) lid attachment. These techniques can be employed in either a leadless chip carrier or a single layer ceramic base configuration. A package (200) for a surface acoustic wave device (70) in accordance with one embodiment of the invention is suitable for enclosing the device (70) in a hermetically sealed environment such that the resulting structure takes up a minimum volume of space. The package (200) facilitates automated circuit assembly techniques, allowing compact, low cost products to incorporate frequency selection components (70) when these are made in accordance with the present invention.