| 发明名称 |
Pressure-sensitive adhesive sheet for preventing a transfer of adhesive substance to a ring frame, and wafer support comprising said pressure-sensitive adhesive sheet |
| 摘要 |
The present invention disposes an easily releasing layer on a surface intended for dicing tape sticking of a dicing ring frame to thereby enable preventing the transfer of an adhesive substance to the ring frame for use in semiconductor wafer working, reducing the frequency of cleaning of the ring frame to the requisite minimum and prolonging the life of the ring frame. <IMAGE> |
| 申请公布号 |
EP0715341(A1) |
申请公布日期 |
1996.06.05 |
| 申请号 |
EP19950118715 |
申请日期 |
1995.11.28 |
| 申请人 |
LINTEC CORPORATION |
发明人 |
SENOO, HIDEO;SUGINO, TAKASI |
| 分类号 |
B28D5/00;B28D7/04;C09J9/00;H01L21/00;H01L21/301;H01L21/302;H01L21/304;H01L21/68 |
主分类号 |
B28D5/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
