发明名称 |
Electroless plating bath of iridium |
摘要 |
The present invention relates to a plating bath of the hydrazine type for electroless plating on the surface of a plated substance with iridium. The first plating bath is an electroless plating bath of iridium which contains a hydrazine complex of iridium and has pH of 1-7. The second plating bath is an electroless plating bath of iridium which contains hydrazine hydrate and/or hydrazinium salt, and iridium halide and/or halogenoiridate in the molar ratio of 1-10 and has pH of lower than 3. The plating bath of this invention is used, for example, for producing of a junction of a cation exchange membrane and iridium, which is used for a water electrolytic cell of the macromolecule solid electrolyte type. <IMAGE> |
申请公布号 |
EP0715000(A1) |
申请公布日期 |
1996.06.05 |
申请号 |
EP19950118724 |
申请日期 |
1995.11.28 |
申请人 |
RESEARCH INSTITUTE OF INNOVATIVE TECHNOLOGY FOR THE EARTH;AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY |
发明人 |
MORI, HIROAKI;OGURO, KEISUKE;MAEZAWA, SHOJI;TORIKAI, EIICHI |
分类号 |
C25B9/00;C23C18/44;C25B9/10 |
主分类号 |
C25B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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