| 摘要 |
<p>PURPOSE: To produce a noncontact type IC card by a simplified and industrially advantageous method using a split type mold having the support member of an IC card element provided thereto so as to be accessible to a cavity and fixing the IC card element at the almost central part in the thickness direction of the cavity. CONSTITUTION: A split type mold 40 wherein four support members 5a, 5b, 6a, 6b are provided so as to be accessible to the interior of a cavity 41 from the opposed inner wall surfaces 10a, 20a of the mold 40, an IC card element 2 is held between the support members 5a, 5b and between the support members 6a, 6b to be fixed. A thin non-contact type IC card can be produced by injection molding by a simplified and industrially advantageous method. A bonding process for a plurality of the parts of the IC card element 2 becomes unnecessary.</p> |
