发明名称 |
MOLDING OF RESIN MOLDED PRODUCT |
摘要 |
PURPOSE: To prevent the local lowering of crosslinking density at the part under the liquid level of a high temp. liquid of a molded container while preventing the generation of the phenomenon such as a void caused by vacuum degassing. CONSTITUTION: A thermosetting resin mixed with a crosslinking agent is heated and pressed by a split mold 2 to mold a resin molded product being a container in which a high temp. liquid is charged so that the liquid level thereof is set to a predetermined position or less. The thermosetting resin is arranged at the position of the cavity 3 of one mold corresponding to the bottom part of the container. Next, the clamping of the split mold 2 is started. The cavity 3 becomes airtight in the mold clamping process and, after the thermosetting resin passes the position of the cavity 3 of the split mold 2 corresponding to the predetermined position of the container to be molded, the vacuum degassing of the cavity 3 is started and subsequently completed simultaneously with the completion of the clamping of the split mold 2. |
申请公布号 |
JPH08142075(A) |
申请公布日期 |
1996.06.04 |
申请号 |
JP19940290848 |
申请日期 |
1994.11.25 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD;NIPPON SHOKUBAI CO LTD |
发明人 |
IKEGAWA NAOTO;AZUMA KEIJI;YAMAUCHI SATORU;KOBAYAKAWA MASUNORI;MATSUMOTO MASAMI;TANAKA MITSUZO;OKA SHIGERU |
分类号 |
B29C43/02;B29C43/34;B29C43/56;B29K101/10;B29L22/00;(IPC1-7):B29C43/02 |
主分类号 |
B29C43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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