NONCONTACT TYPE IC CARD AND PRODUCTION THEREOF

摘要

PURPOSE: To produce a noncontact type IC card having a novel structure wherein an IC card element is embedded in a card in such a state that the entire surface thereof is fixed by a simplified and industrially advantageous method embedding the IC card element embedded in an electric insulating fiber material in the integrally molded card. CONSTITUTION: A notch part is provided to an intermediate layer 2 composed of an electric insulating fiber material at the almost central part thereof and an IC card element 4 is fitted in the notch part and surface layers 1, 2 composed of an electric insulating fiber material are superposed on both surfaces of the intermediate layer 2 to form a laminate of the electric insulating fiber material layers having the IC card element 4 embedded therein. This laminate is fitted in the cavity 21 of a lower mold 20 in a close contact state and an upper mold 10 is clamped to perform injection molding. Since the IC card element 4 is embedded in the electric insulating material, a problem such as the disconnection between the parts constituting the IC card element 4 is eliminated though an IC card is produced by injection molding and a bonding process for a plurality of the parts of the IC card element 4 becomes also unnecessary.