APPARATUS FOR PRODUCING TABLET OF MOLDING MATERIAL FOR SEALING SEMICONDUCTOR

摘要

PURPOSE: To produce a tablet excellent in productivity and general purpose properties and enhanced in reliability while preventing the adhesion of a molding material for sealing a semiconductor to a mold and the generation of the wt. irregularity of the tablet or the appearance inferiority of a molded product and shortening a manufacturing process to a large extent. CONSTITUTION: A molding material 4 for sealing a semiconductor is charged in the mortar 3 of a mold and subjected to compression molding by upper and lower pestles to produce a tablet. In this tablet producing apparatus, a part or the whole of the contact surfaces 5, 6 with the molding material for sealing the semiconductor of one or both of the pestles has surface roughness Rmax of 2-100μm.