| 发明名称 |
Coining method for bonding pad surface |
| 摘要 |
The punching face of a punch for coining is set smaller than the bonding pad surface of a lead frame to which wire bonding is applied and coining is applied to only a portion necessary for the wire bonding to be effected on the bonding pad surface.
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| 申请公布号 |
US5522133(A) |
申请公布日期 |
1996.06.04 |
| 申请号 |
US19940243365 |
申请日期 |
1994.05.16 |
| 申请人 |
ROHM CO., LTD |
发明人 |
KAWAUCHI, TAKANOBU |
| 分类号 |
B21D22/02;H01L21/48;H01L23/48;H01L23/495;H01L23/50;(IPC1-7):H01R43/16 |
主分类号 |
B21D22/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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