| 摘要 |
PURPOSE: To provide a wafer sticking device in which a uniform wax thickness and furthermore a uniform wafer plate thickness are obtained when a wafer is fixed to a wafer sticking plate. CONSTITUTION: In a wafer sticking device used in the process of fixing a wafer 1 to a wafer sticking plate 2 with wax, in order to expand the wax 3 in the whole surface of the wafer 1, an elastic pad 7 is mounted on the wafer contact surface side of a stamper 5 for pressing down the wafer 1. In another constitution, through holes are provided at the centers of the stamper of the wafer sticking device and a load shaft for applying a load to the stamper, and also the whole of the wafer contact surface side of the stamper is covered with an airtight film, and the airtight film is inflated by an air pump through the through hole of the load shaft, thereby being able to apply uniform pressure to the wafer. |
