SEMICONDUCTOR DEVICE AND FABRICATION THEREOF

摘要

PURPOSE: To obtain a semiconductor device in which semiconductor chips of different size can be mounted. CONSTITUTION: A part 6 for mounting a semiconductor chip 3 through an insulating member 10 is provided in the center of a substrate 1 having a wiring layer 1a extending from the outer circumferential part to the chip mounting part. When a small-sized semiconductor chip 3 is mounted on the chip mounting part 6, the side face of the semiconductor chip 3 faces the forward end of a lead 7. When a large semiconductor chip 3 is mounted, a part of the semiconductor chip 3 overlaps the chip mounting part 6 through the and insulating member 10 and thereby the lead 7 is connected electrically with the chip electrode of any semiconductor chip 3.