| 摘要 |
The connection element comprises a core (11), pref. a spherical metal or ceramic core, coated with a solder, pref. a Sn, Sn-Au or Sn-Pb solder, having a melting point lower than that of the core. A connection process involves forming a connection pad (22) on the surface of a substrate (21) and piercing a hole (25) through the substrate at the pad position. Another connection pad (31) is formed on the surface of another substrate (30). Solder paste is applied onto the pad (31) and the connection element is positioned on the solder paste. The connection element and the solder paste are heated to cause them to melt for connecting pads (22,31) and at least part of the solder flows into the through-hole (25).
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