| 摘要 |
PURPOSE: To obtain a resin sealed semiconductor device having such structure as a scrubbing motion is allowed for a semiconductor element while positioning the semiconductor element with high accuracy by providing a plurality of protrusions for positioning the semiconductor element at such positions on a heat plate as soft touching at least two sides of the semiconductor device. CONSTITUTION: The resin sealed semiconductor device comprises a heat plate 11, a substantially rectangular semiconductor device 3 bonded onto the heat plate 11 through a thermally conductive adhesive 4, and electrodes 6, 7 connected electrically with the semiconductor device 3. The semiconductor device further comprises a plurality of protrusions 9 for positioning the semiconductor element 3 disposed at such positions on the heat plate 11 as soft touching at least two sides of the semiconductor element 3, and a resin 2 for sealing the heat plate 11, the semiconductor element 3, and the electrodes 6, 7. For example, columnar protrusions 9 for positioning the semiconductor element 3 are provided at three positions on the heat plate 11 so that a vertical scrubbing motion is allowed for the semiconductor element 3 while limiting the lateral and downward motion thereof. |
