| 摘要 |
PURPOSE: To provide a method of manufacturing a high density circuit board. CONSTITUTION: Through holes 2 are bored in an insulating board 1 of a resin film. It is sandwiched between adhesive material sheets 4 in which conductive particles 3 are dispersed and copper foils 5 (c). In this state, a pressure is applied in the vertical direction, via silicone rubber 6 and metal plates 7, and the adhesive material sheets 4 are cured by heating. As the result of pressing, the copper foils 5 comes into contact with each other in the through holes 2, via the conductive particles 3. Hence electric connection appears. A copper foil patterning process is performed on the unified board (e), and circuits 9a, 9b are formed. Thereby a double-sided board shown by figure (f) is obtained. |
