| 摘要 |
PURPOSE: To align easily a semiconductor package with a heat sink prior to their bondings and shorten their working times, by interposing a sheet having the shape of the cover of a box between the side surfaces of the heat sink and the semiconductor package. CONSTITUTION: On the part of a heat sink 1 whereto the wiring board of a semiconductor package 2 is bonded, a bonding prepreg 9 is superimposed, and a box type sheet 8 is put on the upper part of the heat sink 1, and further, the semiconductor package 2 is combined with the heat sink 1. Thereafter, pressures are applied to the whole of this product from above it and from under it, and simultaneously, the temperature of 175 deg.∥C is given to the product. Further, since the shape of the sheet 8 becomes a plane in the position of the semiconductor mounting part of the heat sink 1, the sheet 8 can be removed easily by a suction under reduced pressure. Also, by the sheet 8, a fixed distance is maintained between the heat sink 1 and the semiconductor package 2, and thereby, the semiconductor package 2 and the heat sink 1 are aligned with each other easily prior to their bondings.
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