| 摘要 |
PURPOSE: To obtain the title manufacturing board having excellent bonding power onto a plating copper and fine viahole forming property by a method wherein, as for an insulating layer, a sensitive resin using acrylonitrile butadiene rubber with a specific inner mold release agent and methacrylic acid, etc., added thereto as an essential component or sensitive and thermosetting resin are applied. CONSTITUTION: As for an insulating layer 3, tri, di or mono long chain phosphoric ester having carbon numbers of alkyl radical in 6-18, hn inner mold release agent comprising ester and amine salt, methacrylic acid and/or sensitive resin and/or sensitive and thermosetting use together to be a base containing acrylic acid added acrylonitrile butadiene rubber are applied. The insulating layer 3 is formed on a circuit surface formed of the first circuit 2 and then a viahole connecting to the first circuit is formed on the insulating layer 3. Next, copper plating is precipitated on the insulating layer 3 so as to form the second circuit 8 and interlayer-connect a viahole 61. Finally, circuit layer conductor surface of the insulating layers 3, 9 supporting the next circuit layers are roughened. |
