| 摘要 |
PURPOSE: To obtain the multilayer wiring board having high bonding power onto a plating copper and yet excellent surface smoothness by a method wherein, as for the insulating layer to be multilayered by circuit formation and interlayer connection of viaholes, a sensitive resin containing crosslinked acrylonitrile butadiene rubber particles or a sensitive and thermosetting resin is to be applied. CONSTITUTION: The first circuit 2 is formed on a copper clad glass epoxy resin laminated layer substrate 1. Next, an insulating layer 3 of a sensitive insulating resin containing crosslinked carbonic acid denatured acrylonitrile butadiene rubber particles is formed on one surface of said substrate 1. Next, the whole surface is irradiated with ultravoilet rays through the intermediary of a mask and then not yet exposed paste is selectively removed to form a viahole 6. Next, the insulating layer is immersed in a roughening solution to form roughened rugged shape furthermore, a conductor layer is formed by electrolytic plating step using copper sulfate. Next, a plating conductor is etched away to form the second circuit 8 including the viahole 6 connected to the first circuit 2. Furthermore, the second circuit 8 conductor surface is made rugged for multilayer lamination to repeat the lamination step. |
