| 摘要 |
PURPOSE: To manufacture the title printed-wiring board capable of high-density wiring and packaging in a simple process yet in high reliability. CONSTITUTION: The title manufacturing method of printed-wiring board is composed of forming step of a specific positive pattern using the first nagative pattern 2 conductive metallized layer 1 as one electrode and forming said positive pattern 3 comprising conductive metal on the exposed surface of the electrode, formation-providing step of circular conic or pyramidic conductor bump 4 on a specific position as well as lamination-arranging step of the second conductive metallic layer 1' whereon specific positive pattern 3' is formed on a main surface through the intermediary of a synthesic resin base sheet 5 aligned with opposite positive pattern 3 surface. Furthermore, the electrically connecting step of the laminated body pressurized to insert and penetrate the front end parts of respective conductor bumps 4 into the synthetic resin sheet 5 to the opposite positive patterns 3' as well as the exposing step of the positive patterns 3, 3' by removing the first and second respective conductive metallic layers 1, 1'. |
