| 摘要 |
PURPOSE: To increase the bonding strength between an insulating layer and a conductive circuit for manufacturing high reliable multilayer wiring board by a method wherein, after the formation step of a conductive circuit, the roughening step of conductor surface is performed using a roughening solution containing a conductor corrosion inhibitor within the title manufacturing method by build up mode. CONSTITUTION: A through hole 103 is formed on a glass epoxy laminated board 101 having both surfaces thereof clad with copper foils 102. Next, the copper foils 102 are etched away to form conductor circuit 104 for roughening the conductor surface so as to form conductor roughened surface 105. Next, insulating layers 106 of sensitive resin composition are formed on the board to be selectively etch-patterned and then roughened using roughening solution containing conductor corrosion inhibitor so as to form the other roughened surface 110. Next, the whole body is immersed in a plating catalyst solution to form a copper plating layers 111. Finally, by repeating the steps, conductor circuit layers 112 are formed and then the conductor circuit surfaces are roughened to form the other roughened surfaces 113 further forming the insulating layers 114 on the upper parts of said surfaces 113. |
