| 摘要 |
PURPOSE: To obtain a method for forming an enclosure of semiconductor device using a die having simple structure which can easily deal with an enclosure of different shape. CONSTITUTION: The sealed part of a semiconductor chip 27 or the like, mounted on a lead frame 28 is surrounded by upper and lower elastic frames 31, 24. A sealing resin 26 is fed to the inside and fused and then it is pressed and hardened by means of upper and lower dies 34, 23 while deforming the upper and lower elastic frames 31, 24 elastically in the vertical direction. When the supply of sealing resin 26 fluctuates, elastic deformation of the upper and lower elastic frames 31, 24 varies to absorb the fluctuation without requiring a die having intricate structure. Furthermore, an enclosure having different shape can be dealt with easily by replacing the upper and lower elastic frames 31, 24 with corresponding ones. |
