| 摘要 |
PURPOSE: To obtain a semiconductor device comprising a resin sealed semiconductor chip incorporating an integrated circuit, e.g. an LSI, in which wire short is prevented while reducing the chip size. CONSTITUTION: A large number of electrodes 12 are arranged in two rows, while being shifted between the rows, along the fringe of an LSI chip 10 and only one row of electrodes are arranged in the vicinity of the corner of the chip 10. Each electrode 12 is connected through a bonding wire 18 with the inner lead part 16a of a corresponding lead. The chip 10, the supporting stage 14, the inner lead part 16a, the wire 18, etc., are then resin sealed and the outer lead part is led out therefrom. This structure prevents the wire 18 from being deflected in the vicinity of the corner of the chip by the molding pressure to cause wire short. |
