| 摘要 |
<p>PURPOSE: To handle a wafer without damaging it by processing the wafer in all processes with ultraviolet ray-hardened adhesive tape supported in a frame being applied to the element formation surface of the wafer. CONSTITUTION: An adhesive tape 52 is placed on the element formation surface 53a of a wafer 53 and pressed by a wafer pressing part 1b to apply the adhesive tape 52 to the element formation surface. Next, the back of the wafer 53 is ground up to the desired plate thickness of a semiconductor chip by a grinding tool 2b. Next, the semiconductor chip is cut off by a rotary cutter 3d from the back of the wafer 53 which is position. Next, the adhesive tape 52 is hardened by ultraviolet rays emitted from a UV lamp. Next, when the recessed part of the tape sucking part 5b of a chip collet 5a is evacuated, thereby sucking the adhesive tape 52, a semiconductor chip 54 is separated from the adhesive tape 52. Thereby, a thin wafer can be handled.</p> |
