| 摘要 |
<p>PURPOSE: To provide a multichip module which has high heat dissipation property, enables thinning and high density, and is not affected by stress. CONSTITUTION: The multichip module has a structure wherein a package 1 having a plurality of leads 5 in a side wall part is provided, at least one cut opening part is formed in an inner side bottom of the package 1 through an adhesion layer 7, a semiconductor chip 4 is put inside each cut opening part, a silicon circuit substrate 2 wherein a thin film multilayer wiring layer 3 is formed in a surface layer is fixed and a the semiconductor chip 4, the lead 5 and the thin film multilayer wiring layer 3 are electrically connected by a metallic fine line 6.</p> |
