MANUFACTURE OF LEAD FRAME AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide a lead frame with a heat sink without any caulking, which maintain adequate adhesion with resin. CONSTITUTION: A pattern is formed so that a lead 12 is extended in a direction crossing thin connection lines 10. A heat sink 13 is laid out closer to one of the interlocking thin lines 10. The heat sink 13 is fixed to either the thin connection lines 10 or a tie bar 11 by a plurality of retention parts. A grounding lead 15 for connecting a heat sink 13 and thin lines 10 and one portion of the tie bar 11 are subjected to bending, thus enabling the tip of the lead 12 to be superposed to an area above the heat sink 13 by the length used for binding. A shearing machining part is provided to create a protrusion by exposing the material of the heat sink 13 at a boundary 23 between a thick part 20 and a thin part 21 on the reverse side of the heat sink 13.