| 摘要 |
PURPOSE: To improve productivity and reliability and allow the use of conventional molding equipment by performing resin sealing by using a molding die without using potting resin. CONSTITUTION: A prescribed integrated circuit element 12 is bonded with conductive adhesive 30 on the element mounting part at the center of an integrated circuit mounting board 11, and the pad part on the integrated circuit element 12 is bonded with each wire bonding part 19 which is opened by a wiring hole 20 on a lead pattern 18 by bonding wire 31. Resin sealing is performed by putting the resin sealing part in the prescribed molding die. Then, ball solder 13 is formed at a ball solder forming part which is exposed at the bottom in lattice-shape. Thus, sealing resin body 14 is uniformly formed and a plurality of semiconductor device are manufactured at one time.
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