| 摘要 |
<p>PURPOSE: To facilitate interconnection of thin film integrated circuits and to increase the process margin. CONSTITUTION: A thin film integrated circuit on a glass substrate and external thin film integrated circuit 27 are interconnected, using a converged ion beam. The top ends of electrodes extending from the circuit 24 on the glass substrate are connected to electrode pads 28 of the circuit 27 through conductors of W, using this beam. Thus, the process margin can be increased against the shrinkage and deformation of the glass substrate.</p> |
