ELECTRONIC EQUIPMENT AND ITS MANUFACTURE

摘要

PURPOSE: To quickly transmit heat of an LSI package mounted on the printed board in an electronic equipment to its case. CONSTITUTION: A QFP 6 mounted on a printed board 3 is covered with a metal spacer 5; an elastic heat sink 8 is provided in a space between the QFP 6 and the spacer 5; and an elastic heat sink 12 is provided in a space between the case 7 of the electronic equipment mounted with the printed wiring board 3 and the spacer 5.