摘要 |
The invention concerns thermoplastic moulding compounds containing: A) 10 to 99 wt % of a polyoxymethylene homo or copolymer; B) 0.05 to 2 wt.% of an isocyanurate of formula (I), in which R<1>, R<2>, R<3> mean identical or different groups (10) and R<4>, R<5>, independently of each other, designate hydrogen or a C1-C4 alkyl group and n is an integer from 1 to 3, or of a triazine derivative of formula (II) or their mixtures, in which R<a> designates hydrogen, an aliphatic group with 1 to 12 carbon atoms, a phenyl group, (a), (b), wherein R<6> stands for a C1-C4 alkyl group, (c), wherein R<7>, R<8> mean identical or different hydrogen or C1-C4 alkyl groups, (d), wherein R<9> stands for hydrogen or a methyl group and m is an integer between 0 and 20, (e), (f), R<b> and R<c>, independently of each other, designating hydrogen, halogen, a cyano group or a C1-C4 alkyl group; C) 0.05 to 2 wt.% of at least one sterically hindered phenol compound; D) 0.05 to 2 wt.% of at least one sterically hindered amine compound; E) 0 to 2 wt.% of at least one stabilizer selected from the group comprising benzotriazole derivatives or benzophenone derivatives or aromatic benzoate derivatives; and F) 0 to 80 wt.% of conventional processing aids and additives. The weight percentages of components A) to F) total 100 %.
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申请人 |
BASF AG, 67063 LUDWIGSHAFEN, DE |
发明人 |
KIELHORN-BAYER, SABINE, DR., 67133 MAXDORF, DE;EICHENAUER, ULRICH, DR., 68309 MANNHEIM, DE |