发明名称 POLYAMIDE RESIN COMPOSITION
摘要 Disclosed is a polyamide resin composition comprising a melt-kneaded product of (A) a polyamide; (B) a polyphenylene ether; (C) a styrene polymer; and (D) a compound having in a molecule thereof a carbon-to-carbon double bond and at least one functional group selected from the group consisting of a carboxylic acid group, an acid anhydride group, an epoxy group, an amino group and a hydroxyl group, wherein the polyamide (A) is present as a continuous phase in which the polyphenylene ether (B) and the styrene polymer (C) are dispersed individually, independently or in mixture thereof to form a dispersion phase having an average particle diameter of 5 mu m or less, and wherein the polyphenylene ether (B) and the styrene polymer (C) are present in a (B)/(C) weight ratio of from 20/80 to 70/30, and the styrene polymer (C) in the melt-kneaded product has a reduced viscosity of 0.70 dl/g or more. The polyamide resin composition of the present invention has not only excellent mechanical properties, heat resistance, molding processability, light stability, weatherability and good appearance of a shaped resin article produced therefrom, but also high resistance to a dimensional change and to a lowering of stiffness when exposed to water, and high chemical resistance. The polyamide resin composition of the present invention is useful for producing various shaped resin articles, such as exterior and interior parts of automobiles, electronic parts, electric parts, civil engineering materials and construction materials.
申请公布号 WO9616123(A1) 申请公布日期 1996.05.30
申请号 WO1994JP01947 申请日期 1994.11.18
申请人 ASAHI KASEI KOGYO KABUSHIKI KAISHA;NAKAHASHI, JUN-ICHI;HORIO, MITSUHIRO;YOSHIDA, KAZUO 发明人 NAKAHASHI, JUN-ICHI;HORIO, MITSUHIRO;YOSHIDA, KAZUO
分类号 C08L71/12;C08L77/00 主分类号 C08L71/12
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