Verfahren zur Abscheidung metallischer Schichten auf Substratkörpern und Verbundkörper aus einem Substratkörper und mindestens einer Oberflächenschicht

摘要

The invention concerns a method of depositing metal films on substrates made of hardmetal, cermet, steel or ceramic material, using metal halides as the reaction gas in a plasma CVD process in which the substrate temperature is < 500 DEG C. The invention also concerns a composite consisting of a steel, cermet, hardmetal or ceramic substrate plus at least one metal or metal-alloy surface film applied by a plasma CVD process using metal halides as the reaction gas. The chlorine content of the metal or metal-alloy film is less than 1 % by wt.