| 摘要 |
PURPOSE: To provide a low-cost multiple-terminal semiconductor device. CONSTITUTION: A first lead terminal 5 with an island part 5a and second and third lead terminals 6 and 7 are formed in one piece at a lead frame. After applying solder paste 8 to the island part of the first lead terminal, a semiconductor chip 9 with two protruding electrode parts 9a and 9b is mounted and tip parts 6a and 7a of the second and third lead terminals are overlapped at the upper surface side of the semiconductor chip while solder paste 10 and 11 are applied to each protruding electrode part on the upper surface of the semiconductor chip before being heated to a temperature exceeding the melt point of solder. |
