Compliant layer metallization

摘要

A compliant layer metallization for relieving thermal and mechanical stress developed between a semiconductor (104) and a semiconductor submount (108). The compliant layer metallization includes a compliant layer (206), a wetting layer (210) and a barrier layer (208). The compliant layer provides thermal and mechanical stress relief. The wetting layer ensures adequate wetting during soldering. The barrier layer prevents diffusion of bonding material into the compliant layer and/or into the semiconductor during solder-bonding. The compliant layer metallization design promotes ease of manufacturing.