| 摘要 |
<p>Process for applying flux to a solder work surface having a predetermined temp. comprises: providing a solventless flux in a liq. phase in a flux reservoir (50) from a solid or liq. flux stable at ambient temperature; creating a flux vapour in a flux application zone (39) by heating the flux in the reservoir, the vapour being at a temp. greater than the predetermined temp.; and passing the work surface through the application zone so that flux vapour condenses on the work surface, whereby flux is applied without volatile organic chemicals. The appts. for carrying out the above process is also claimed. The flux is dibasic or monobasic acid, i.e. adipic, malonic, maleic, glutaric, pimelic, valeric, caproic, enanthic, capric, myristic, palmitic or stearic acid. Solid flux is melted to give liq. phase. Inert gas is introduced into liq. phase. Evaporation is controlled by heating and introduction of inert gas. Walls of reservoir are heated to prevent solidification of flux. Application zone is enclosed, with apertures opening and closing to admit and exit work surface. Flux vapour is trapped at openings for work surfaces. Level of flux is maintained in reservoir.</p> |
