| 摘要 |
PURPOSE: To provide an adhesive for a copper foil which is easy to handle, can be press-bonded to a substrate, such as a metal plate or a plastic plate, at temps. and pressures lower than in the case of a conventional adhesive for a copper foil, and exhibits excellent adhesive properties and heat resistance even when cured under no pressure and to provide a copper foil with the adhesive. CONSTITUTION: An adhesive for a copper foil is provided which is prepd. by compounding 60-100 pts.wt. epoxy resin. of which 0.5-20 pts.wt. being a rubber- modified epoxy resin, with 5-30 pts.wt. polyvinyl acetal resin. A copper foil with the adhesive is also provided. |
