| 摘要 |
PURPOSE: To obtain a molded para-oriented aromatic polyamide reduced in moisture absorption and coefficient of expansion caused by moisture absorption by heating a film containing a specific amount of metal ions to regulate the density of the film to a specific value. CONSTITUTION: The molding consists substantially of a para-oriented aromatic polyamide having an inherent viscosity of 3.5 or higher. It has a content of metal ions bonded to the acid groups of the polyamide molecules of 10-500ppm, and has a density of 1.390-1.470g/cm<3> . This molding produced from a para-amide solution is obtained by neutralizing the acid component contained in the solution, washing the solution with water, treating the same with an at least 0.001wt.% aqueous solution of carbon dioxide, and then heating the solution at 350-500 deg.C. Examples of the molding include fibers, pulplike particles, and films. An especially preferred example of the para-amide is poly-p-phenyleneterephthalamide. |
