| 发明名称 |
MANUFACTURE OF RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METAL MOLD USED FOR SAID MANUFACTURE |
| 摘要 |
PURPOSE:To obtain a sealing device which is free from the flash by providing a projection part to the metal mold touching the metal substance near the cavity and then clamping the metal substance with the metal mold to inject the resin. |
| 申请公布号 |
JPS53124075(A) |
申请公布日期 |
1978.10.30 |
| 申请号 |
JP19780031051 |
申请日期 |
1978.03.20 |
| 申请人 |
HITACHI LTD |
发明人 |
HAJIME TETSUO |
| 分类号 |
H01L21/56;B29B7/00;B29C39/00;B29C39/10;B29C39/28;B29C45/14 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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