Electrostatic chuck having relatively thick and thin areas and means for uniformly cooling said thick and thin areas during chuck anodization

摘要

An aluminum electrostatic chuck for holding semiconductor wafers during wafer processing. The chuck is characterized by a closely determined magnitude of electrostatic holding force due to an anodization step for creating a finely uniform thickness of dielectric material on the chuck surface facing the wafer which, in turn, determines the holding force. The chuck cross section comprises two different thickness areas with fluid cooling being applied to the thinner thickness area during chuck anodization to assure thickness uniformity of the anodized material across the face of the chuck.