Probe apparatus for testing multiple integrated circuit dies

摘要

There is provided a probe apparatus with a stage for holding a wafer on which a plurality of chips are regularly arranged such that the chips are arranged substantially in an XY plane, a large number of contactors facing the wafer held on the stage, provided to corresponding to respective pads of the chips such as to be brought into contact collectively with the pads of all the device circuits on the wafer, tester for transmitting/receiving a test signal to/from the device via the contactors, elevator device for elevating the stage in a Z-axis direction, alignment device for moving the stage in an X-axis and/or Y-axis direction, and controller for controlling the alignment device and the elevator device.