| 摘要 |
PURPOSE: To obtain a wiring structure which is free from the peeling of the conductor part and the occurrence of crack of the base material by providing a conductor layer and an insulating film containing a specified polyimide and, in addition, a conductor layer comprising a conductive material on the surface of the insulating film. CONSTITUTION: A polyimide is produced by polymerizing a tetracarboxylic acid dianhydride represented by formula I (wherein R<1> is a tetravalent organic group of, e.g. formula II, III or IV) (e.g. pyromellitic dianhydride) and a diamine compound represented by formula V (wherein R<2> is a divalent organic group of, e.g. formula VI, VII, VIII or IX) (e.g. p-phenylenediamine). A conductor layer (e.g. a chromium layer) and an insulating film containing the polyimide are provided on a base board, and a conductor layer comprising a conductive material (e.g. nickel) is provided on the surface of the insulating film, thus producing a wiring structure. Since the polyimide used has low coefficient of thermal expansion, the crack of the polyimide film does not occur even if a conductor composed mainly of nickel is used for an electrode. |
