An electroless metal plating solution comprising metal ions to be reduced for plating onto a substrate and a chelate for the metal to prevent or reduce metal hydroxide precipitates forming and to buffer the amount of metal ions available for reduction, wherein the chelate is at least EDDS is described.
申请公布号
WO9615290(A1)
申请公布日期
1996.05.23
申请号
WO1995GB02633
申请日期
1995.11.09
申请人
THE ASSOCIATED OCTEL COMPANY LIMITED;MACMILLAN, JOHN, ALEXANDER