摘要 |
An improved automated method for the manufacture of alternatively sized passive transponder devices is presented which utilizes a single leadframe design and manufacturing process, including automated coil winding and wire-to-lead termination. A specially designed leadframe is prepared, with augmented leads, and is coated with a thin layer of silver. One or more semiconductor chips are bonded to individual assembly sites on the leadframe, after which the lead-die assembly is encapsulated by transfer molding. The cap and leads are singulated, and a bobbin is attached to the leads, which extend laterally from each individual molded cap. In an automated process, a conductive wire is attached to a first of the protruding leads, fly-wound around the bobbin core, and terminated by connection to a second of the protruding leads. |
申请人 |
TROVAN LTD., SANTA BARBARA, CALIF., US |
发明人 |
ZIRBES, GLEN, LEO, SILVER LAKE, MN 55381, US;HADDEN, LEONARD, D., MINNEAPOLIS, MN 55409, US;TROYK, PHILIP, R., MORTON GROVE, IL 60053, US |