Inhomogeneous composition bump contact for surface mounted device flip-chip technology

摘要

The bump contact (4) has an inhomogeneous composition with the solder section (6) to be melted having a lower melting point than the main solder. A section of the bump contact core (5) determines the minimum height of the contact melting at a temperature higher than that of the solder. A large proportion of the solder required for a solder bond is contained in the solder to be melted. The core section can be in the form of a bump contact socket on which is placed the solder. It can also take the form of a layer with the solder in layers or as a ball, wedge or globule.