发明名称 WAFER-STAGE TEMPERATURE COMPENSATION FOR IC COMPONENTS
摘要 An integrated circuit has at least two components described in the form of two ideally matched transistors, each of which operate interdependently as a function of temperature and at least one physical parameter associated with each of said components when implemented in integrated form. The circuit further includes compensation means (Q9-Q16, R2-R4), disposed in the integrated circuit, for generating and applying a bipolar compensation signal (Isym) to at least one of said components (Q6) so that said two components interdependently operate predictably, consistently and independently of temperature variations and differences between the physical parameter of said two components. The bipolar current is necessary so that both the level and polarity of the compensation signal can be appropriately adjusted during the manufacture of the integrated circuit as a wafer so as to eliminate the need to compensate for any mismatches in the two components following such manufacture.
申请公布号 WO9615586(A1) 申请公布日期 1996.05.23
申请号 WO1995US15442 申请日期 1995.11.07
申请人 THAT CORPORATION 发明人 HEBERT, GARY, K.
分类号 H03F1/30;H03G3/10;(IPC1-7):H03F1/30 主分类号 H03F1/30
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