| 摘要 |
The invention provides a circuit element mounting structure comprising: a substrate (1) having a pattern A (11) of wirings therein; at least one cavity (16a) formed at a surface of the substrate (1); and a cap (2) for covering the cavity (16a) therewith, characterized by the cap (2) including a pattern B (7) of wirings therein and a connection B (5, 5a) for electrically connecting the pattern B (7) of wirings to the pattern A (11) of wirings, and the substrate (1) including a connection A (10, 10a) for electrically connecting the connection B (5, 5a) to the pattern A (11) of wirings. In accordance with the invention, it is now possible to mount circuit elements on a cap which had been a dead space in prior circuit, and hence also possible to mount circuit elements in higher density on a substrate including a cap zone. <IMAGE> |
