| 摘要 |
The method for fabricating a tantalium chip condenser includes the steps of plating the negative electrode(2) of a lead frame with silver and allowing the positive electrode(2a) to be in nonplating state, welding a device(5) on the electrodes(2,2a), molding the connection of the electrodes(2,2a) and device(5) to form a package(6), and forming a lead plating layer(4) on the lead frame externally exposed.
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