Molding method and apparatus

摘要

A molding apparatus for manufacturing a high-quality semiconductor integrated circuit device has such a simplified structure as removing air vents (85) and ejector pins (26, 36). The molding apparatus has a function of preventing any foam, sink and resin flash on a mold. Plural semiconductor chips are fitted to a lead frame (42) for composing a chip-lead compound (40). This chip-lead compound (40) is placed between an upper and a lower dies (76, 78) provided in the molding apparatus. When the dies (76, 78) are matched with each other, mold cavities (43) are formed. At least a part of each mold cavity (43) is formed of such a porous material as inhibiting intrusion of mold resin and allowing gas components to pass therethrough for preventing occurrence of voids. When mold clamping is performed in the state that the chip-lead compound (40) is placed between the dies (76, 78), resin is implanted into the mold cavities (43), when the inside of each mold cavity (43) is opened to the atmosphere through a porous material or is set to have a far smaller pressure than the implanting pressure of the mold resin. The molding apparatus provides a two-stage ventilating portion (123b, 124b, 150a, 151a) in at least one of the upper and the lower dies (123, 124). The ventilating portions serve to guide out the air left in the resin press-fitting portions (130, 131). The ventilating portions are made porous and having base ventilating portions (123b, 124b) provided in the upper or the lower die (123 or 124) and surface ventilating portions (150a, 151a) located on the surfaces of the base ventilating portions (123b, 124b) and contacting the molten resin (128). The surface ventilating portion (150a or 151a) has pores (90) in smaller diameter than the base ventilating portion (123b or 124b) and is replaceable. The surface ventilating portion (150a or 151a) is formed by transforming an extensible porous film (150 or 151) stretched on each parting face (123a or 124a) of the upper and the lower dies (123, 124). The two-stage ventilating portions (123b, 124b, 150a, 151a) provide sucking means and compressed gas supplying means.