发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF FORMING SAME |
摘要 |
A method of fabricating a printed circuit board is disclosed. The method comprises forming a metal substrate having a through-hole pattern. The metal substrate is coated with a dielectric powder having a suitable flow length value to form a dielectric coat on the substrate having a sufficient through-hole edge coverage. The dielectric coated substrate is then treated with a second powder to form a satisfactory topcoat thereon. Electrical circuitry is then formed on the topcoat in conjunction with the through hole pattern. |
申请公布号 |
JPS53126161(A) |
申请公布日期 |
1978.11.04 |
申请号 |
JP19780040459 |
申请日期 |
1978.04.07 |
申请人 |
WESTERN ELECTRIC CO |
发明人 |
JIYOSEFU JIYOOSHIN CHIYANGU |
分类号 |
B32B15/08;H05K1/05;H05K3/00;H05K3/44 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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