| 摘要 |
<p>PURPOSE: To inhibit the increase of the installation area of a peeling tank while improving throughput by peeling carbon for slice under the state that a wafer is supported as laminated. CONSTITUTION: Wafers W as laminated are put on the bottom plate 2 of a carrier (a wafer handling jig) 1. The carrier 1 is carried to the place of peeling by utilizing a handle 4, and dipped in chemicals, etc., in a peeling tank 60 together with the carrier 1, thus peeling carbon C for slice. The carrier 1 is taken out from chemicals, etc., the wafers W supported on the bottom plate 2 are extracted successively from upper sections, and chemicals, etc., are washed off. The wafers W are dried, and stored in a specified carrier. Accordingly, the increase of the installation area of a peeling device 60 can be inhibited while throughput is improved.</p> |
