发明名称 WAFER HOUSING
摘要 <p>PURPOSE: To provide a wafer housing which can cope with the miniaturization and the space reduction of a manufacturing equipment. CONSTITUTION: A wafer housing 1 is provided with a pair of side boards 2 which are arranged so as to leave a specified space for arranging a plurality of wafers 10 in almost parallel in the space, and a bellows 3 which is constituted of at least three expansion members. These expansion members have a plurality of trenches 3a into which the peripheral parts of a plurality of the wafers 10 are inserted along the longitudinal direction, and are arranged so as to freely expand in response to the change of gap between a pair of the side boards 2 and almost perpendicularly to the side boards 2 in the state that the members connect the part between a pair of the side boards 2. The pitches of a plurality of the trenches are variable in response to expansion and contraction.</p>
申请公布号 JPH08130238(A) 申请公布日期 1996.05.21
申请号 JP19940268715 申请日期 1994.11.01
申请人 SONY CORP 发明人 ISHIYAMA HIROSHI
分类号 B65D85/86;H01L21/673;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D85/86
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